board cooling heat sink

maxiGRIP™ and Board Level Cooling

Advanced Thermal Solutions Inc

This tutorial will be explaining the need for maximum airflow. Benefits of using a clip, and the steps for installation and removal will be discussed. 

maxiGrip,maxiFlow

ImagineManufacturer Part NumberDescriereAvailable QuantityPrețVedeți detalii
HEAT SINK 17MM X 17MM X 19.5MMATS-51170R-C1-R0HEAT SINK 17MM X 17MM X 19.5MM661 - Immediate$71.11Vedeți detalii
HEAT SINK 23MM X 23MM X 17.5MMATS-50230P-C1-R0HEAT SINK 23MM X 23MM X 17.5MM496 - Immediate$71.33Vedeți detalii
HEAT SINK T766ATS-50450G-C3-R0HEAT SINK T766661 - Immediate$49.05Vedeți detalii
HEAT SINK 19MM X 19MM X 19.5MMATS-51190R-C1-R0HEAT SINK 19MM X 19MM X 19.5MM2609 - Immediate$61.39Vedeți detalii
HEAT SINK 27MM X 27MM X 7.5MMATS-50270B-C1-R0HEAT SINK 27MM X 27MM X 7.5MM182 - Immediate$62.39Vedeți detalii
HEATSINK 35X35X14.5MM W/OUT TIMATS-51350K-C0-R0HEATSINK 35X35X14.5MM W/OUT TIM140 - Immediate$62.39Vedeți detalii
HEAT SINK 35MM X 35MM X 17.5MMATS-50350P-C1-R0HEAT SINK 35MM X 35MM X 17.5MM441 - Immediate$64.75Vedeți detalii
HEAT SINK 31MM X 31MM X 9.5MMATS-51310D-C1-R0HEAT SINK 31MM X 31MM X 9.5MM107 - Immediate$67.62Vedeți detalii
HEAT SINK 21MM X 21MM X 14.5MMATS-51210K-C1-R0HEAT SINK 21MM X 21MM X 14.5MM690 - Immediate$67.71Vedeți detalii
HEAT SINK 35MM X 35MM X 9.5MMATS-51350D-C1-R0HEAT SINK 35MM X 35MM X 9.5MM216 - Immediate$68.76Vedeți detalii
PTM Published on: 2011-10-13

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Related Product Highlight

Heat Sink Attachment Solutions Advanced Thermal Solutions' heat sink attachments give engineers multiple options to mechanically attach almost any heat sink to PCBs.
maxiGRIP™ and superGRIP™ clipKITs™ ATS' maxiGRIP and superGRIP clipKITS offer patented superGRIP and maxiGRIP technology available for straight-fin, slant-fin, cross-cut, and pin-fin heat sinks.
maxiFLOW™ with maxiGRIP™ Heatsinks ATS BGA cooling solutions with maxiGRIP attachment come preassembled with phase change thermal interface materials for easy installation/removal.

Related Articles and Blogs

Feasibility Study of an LED-Based Lighting System Using Analytical Modeling A study of the heat loads for an outdoor LED-based lighting system using analytical modeling to determine the feasibility of the design with solar heat load.
Device Thermal Coupling on a PCB A look at how components on a printed circuit board thermally couple and the design considerations that help minimize heat dissipation problems.
Air Flow Measurement in Electronic Systems An analysis of circuit board air flow measurement techniques and the considerations required to obtain an accurate reading in this complex environment.

Related Product Training Modules

Introduction to Heat Sinks This module will review the use of heat sinks, including how a heat sink works, the factors that impact heat sink thermal performance, common heat sink materials, and thermal interface materials.
clipKIT Heat Sink Attachment Heat sink attachment assemblies are available in ATS’ patented maxiGRIP™ and superGRIP™.
maxiGRIP™ and Board Rework Costs maxiGrip delivers enhanced cooling and enables the user to avoid any damage to the PCB and the BGA package itself.