Assmann WSW Components

Board-Level Heat Sinks

ASSMANN WSW Components' line is suitable for semiconductor devices in D2Pak, SOT-32, TO-220, and TO-263 packages

Image of ASSMANN WSW Components' Board Level Heat SinksThe ASSMANN WSW line offers a selection of attachable, board-level heat sinks. The easy, time-saving assembly is the advantage of this generation. By pushing the heat sink onto the semiconductor housing, the cooling fingers form spring clamps which press the semiconductor housing onto the heat sink. Due to uniform pressure, optimal heat transfer will be realized. This series is offered in different lengths for varied dissipation. Due to the narrow version, this variation occupies very little space.

Features
  • Easy, time-saving assembly
  • Uniform pressure offers optimal heat transfer
  • Varied length options
  • Varied dissipation
Applications
  • Industrial process control equipment
  • Telecommunications equipment
  • Consumer products
  • Automotive

View All ASSMANN WSW Heat Sinks

Heat Sinks

ImagineManufacturer Part NumberDescriereAvailable QuantityPreț
HEATSINK TO-220 19X12.80MMV8508AHEATSINK TO-220 19X12.80MM17051 - Immediate$1.80Vedeți detalii
HEATSINK TO-220 36.83X17.80MMV2006BHEATSINK TO-220 36.83X17.80MM2020 - Immediate$3.20Vedeți detalii
HEAT SINK COPPER DPAK TO-252V-1100-SMD/B-LHEAT SINK COPPER DPAK TO-2526445 - Immediate$2.50Vedeți detalii
HEATSINK ANOD ALUM CPUV2017BHEATSINK ANOD ALUM CPU0 - Immediate$2.94Vedeți detalii
HEATSINK TOP-3 TO-220 SOT-32V7477WHEATSINK TOP-3 TO-220 SOT-324651 - Immediate$4.52Vedeți detalii
HEATSINK ALUM ANODV7238SNHEATSINK ALUM ANOD11510 - Immediate$4.74Vedeți detalii
HEATSINK TO-263 19.38X25.40MMV-1102-SMD/A-LHEATSINK TO-263 19.38X25.40MM10073 - Immediate$7.20Vedeți detalii
HEATSINK ALUM ANODV5618AHEATSINK ALUM ANOD9327 - Immediate$8.82Vedeți detalii
HEATSINK ALUM ANODV5619AHEATSINK ALUM ANOD4931 - Immediate$2.15Vedeți detalii
HEATSINK TO-220 19.05X9.52MMV7235-THEATSINK TO-220 19.05X9.52MM8148 - Immediate$1.93Vedeți detalii

Heat Sink Accessories

ImagineManufacturer Part NumberDescriereAvailable QuantityPreț
HEATSINK ALUM ANODV5816HEATSINK ALUM ANOD10054 - Immediate$0.44Vedeți detalii
HEATSINK ALUM ANODV5815HEATSINK ALUM ANOD6403 - Immediate$0.44Vedeți detalii
HEATSINK CLIP TO-220/TO-3/SOT-32V12HKHEATSINK CLIP TO-220/TO-3/SOT-32153 - Immediate$1.76Vedeți detalii
HEAT SINK CLIP TO-220V08HKHEAT SINK CLIP TO-220866 - Immediate$1.80Vedeți detalii
HEATSINK ALUM ANODV5731HEATSINK ALUM ANOD8449 - Immediate$0.44Vedeți detalii
HEATSINK ALUM ANODV5818HEATSINK ALUM ANOD9754 - Immediate$0.44Vedeți detalii
HEATSINK CLIP TO-220/TO-3/SOT-32V03HKHEATSINK CLIP TO-220/TO-3/SOT-320 - Immediate$1.32Vedeți detalii
CLIP HEAT SINK ASST PKGSV21HKCLIP HEAT SINK ASST PKGS600 - Immediate$1.58Vedeți detalii
HEATSINK CLIP TO-220/TO-3/SOT-32V06HK-THEATSINK CLIP TO-220/TO-3/SOT-324 - Immediate$1.76Vedeți detalii
HEATSINK ALUM ANODV5359HEATSINK ALUM ANOD24378 - Immediate$0.44Vedeți detalii

Heat Sink Hardware

ImagineManufacturer Part NumberDescriereAvailable QuantityPreț
HEX STANDOFF M2.5X0.45 BRASS 5MMV6622AHEX STANDOFF M2.5X0.45 BRASS 5MM38386 - Immediate$1.54Vedeți detalii
HEX STANDOFF M2.5X0.45 BRASS 5MMV6516AHEX STANDOFF M2.5X0.45 BRASS 5MM38712 - Immediate$1.67Vedeți detalii
HEX STANDOFF M2.5X0.45 BRASS 8MMV6516BHEX STANDOFF M2.5X0.45 BRASS 8MM3791 - Immediate$1.76Vedeți detalii
HEX STNDFF M2.5X0.45 BRASS 18MMV6622FHEX STNDFF M2.5X0.45 BRASS 18MM2312 - Immediate$1.71Vedeți detalii
HEX STANDOFF M3X0.5 BRASS 8MMV6621BHEX STANDOFF M3X0.5 BRASS 8MM3444 - Immediate$2.15Vedeți detalii
HEX STNDFF M2.5X0.45 BRASS 15MMV6622EHEX STNDFF M2.5X0.45 BRASS 15MM1673 - Immediate$2.28Vedeți detalii
HEX STNDFF M2.5X0.45 BRASS 25MMV6516HHEX STNDFF M2.5X0.45 BRASS 25MM1692 - Immediate$2.28Vedeți detalii
HEX STANDOFF M3X0.5 BRASS 15MMV6621EHEX STANDOFF M3X0.5 BRASS 15MM1250 - Immediate$2.55Vedeți detalii
HEX STNDFF M2.5X0.45 BRASS 12MMV6516DHEX STNDFF M2.5X0.45 BRASS 12MM8074 - Immediate$2.55Vedeți detalii
HEX STNDFF M2.5X0.45 BRASS 30MMV6622KHEX STNDFF M2.5X0.45 BRASS 30MM2436 - Immediate$2.72Vedeți detalii
Published: 2012-09-17

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