Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
374324B60023G
374324B60023G

374324B60023G

DigiKey Part Number
HS522-ND
Manufacturer
Manufacturer Product Number
374324B60023G
Description
BGA HEAT SINK
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 1.5W @ 50°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Bulk
Part Status
Active
Type
Board Level
Package Cooled
Attachment Method
Solder Anchor
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
1.5W @ 50°C
Thermal Resistance @ Forced Air Flow
6.00°C/W @ 500 LFM
Thermal Resistance @ Natural
30.60°C/W
Material
Material Finish
Black Anodized
Base Product Number
Product Questions and Answers

See what engineers are asking, ask your own questions, or help out a member of the DigiKey engineering community

In-Stock: 1.993
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
All prices are in RON
Bulk
QuantityUnit PriceExt Price
116,08000 lei16,08 lei
1014,22300 lei142,23 lei
2513,54760 lei338,69 lei
5013,05780 lei652,89 lei
21612,08162 lei2.609,63 lei
43211,64419 lei5.030,29 lei
64811,39557 lei7.384,33 lei
1.08011,08961 lei11.976,78 lei
Manufacturers Standard Package
Unit Price without VAT:16,08000 lei
Unit Price with VAT:19,45680 lei