Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
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Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
374324B00035G
374324B00035G

374324B00035G

DigiKey Part Number
HS318-ND
Manufacturer
Manufacturer Product Number
374324B00035G
Description
HEATSINK BGA W/ADHESIVE TAPE
Manufacturer Standard Lead Time
14 Weeks
Customer Reference
Detailed Description
Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level
Datasheet
 Datasheet
Product Attributes
Type
Description
Select All
Category
Mfr
Series
Packaging
Box
Part Status
Active
Type
Board Level
Package Cooled
Attachment Method
Thermal Tape, Adhesive (Included)
Shape
Square, Pin Fins
Length
1.063" (27.00mm)
Width
1.063" (27.00mm)
Diameter
-
Fin Height
0.394" (10.00mm)
Power Dissipation @ Temperature Rise
3.0W @ 90°C
Thermal Resistance @ Forced Air Flow
9.30°C/W @ 200 LFM
Thermal Resistance @ Natural
30.60°C/W
Material
Material Finish
Black Anodized
Shelf Life
-
Base Product Number
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In-Stock: 2.488
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Box
QuantityUnit PriceExt Price
111,49000 lei11,49 lei
1010,15700 lei101,57 lei
259,67400 lei241,85 lei
509,32540 lei466,27 lei
1008,98860 lei898,86 lei
2508,56128 lei2.140,32 lei
7568,07193 lei6.102,38 lei
1.5127,77932 lei11.762,33 lei
5.2927,27630 lei38.506,18 lei
Manufacturers Standard Package
Unit Price without VAT:11,49000 lei
Unit Price with VAT:13,90290 lei