SMD to DIP BGA 36 0.012" (0.30mm) FR4 Epoxy Glass
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BGA0028

DigiKey Part Number
315-BGA0028-ND
Manufacturer
Manufacturer Product Number
BGA0028
Description
BGA-36 TO DIP-36 SMT ADAPTER
Manufacturer Standard Lead Time
4 Weeks
Customer Reference
Detailed Description
SMD to DIP BGA 36 0.012" (0.30mm) FR4 Epoxy Glass
Datasheet
 Datasheet
Product Attributes
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Category
Package Accepted
BGA
Manufacturer
Chip Quik Inc.
Number of Positions
36
Series
Pitch
0.012" (0.30mm)
Packaging
Bulk
Board Thickness
0.063" (1.60mm)
Part Status
Active
Material
FR4 Epoxy Glass
Proto Board Type
SMD to DIP
Size / Dimension
0.700" L x 1.800" W (17.78mm x 45.72mm)
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 1
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All prices are in RON
Bulk
QuantityUnit PriceExt Price
1331,76000 lei331,76 lei
5293,09800 lei1.465,49 lei
10279,28700 lei2.792,87 lei
25263,21080 lei6.580,27 lei
50252,50340 lei12.625,17 lei
100242,90310 lei24.290,31 lei
Manufacturers Standard Package
Unit Price without VAT:331,76000 lei
Unit Price with VAT:401,42960 lei