Carrier Pockets and Cover Tapes

3M's polycarbonate carrier tapes are available in a range of precision-manufactured designs and solutions to help minimize die migration and cracking and to help reduce pick-up failure. Pocket sizes have decreased dramatically in less than a decade. With rising demand for smaller and thinner components and multi-die stacks, as well as the need for individual chip tracking, true success in wafer-level chip scale packaging (WLCSP) requires effective solutions all the way through storage and transport to customers. 3M's semiconductor chip transport solutions start with carrier tapes to help prevent chip migration in thin-package applications. They also provide a comprehensive range of standard and custom cover tapes and precision carrier tapes to maximize yield even for irregular die sizes and pocket shapes.

3M’s carrier pockets shrinking components require sturdy carrier tapes with precise pocket formation to help reduce the risk of component tilt, flip, or migration that can lead to component damage and downtime in the pick-and-place process. 3M offers a full array of non-conductive and static dissipative products with precision pocket designs for various components.

3M’s cover tapes seal 3M component carrier pockets to help protect electrical and electronic components during transport and storage. Their cover tapes offer excellent sealing properties and smooth peel force to help ensure efficient pick-and-place operations. 3M's line of cover tapes includes non-conductive and static-dissipative products with heat-activated (HAA) or pressure-sensitive adhesives (PSAs).