Product Index > Sensors, Transducers > Image Sensors, Camera

Image Sensors, Camera

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Compare Parts Datasheets Image Digi-Key Part Number Manufacturer Part Number Manufacturer Description Quantity Available
Unit Price
RON
Minimum Quantity Packaging Series Part Status Type Pixel Size Active Pixel Array Frames per Second Voltage - Supply Package / Case Supplier Device Package Operating Temperature
   
MT9M114EBLSTCZ-CR1 Datasheet MT9M114EBLSTCZ-CR1 - onsemi MT9M114EBLSTCZ-CR1-ND MT9M114EBLSTCZ-CR1 onsemi SENSOR IMAGE 1MP CMOS 55ODCSP 112 - Immediate Available: 112 lei53.81000 1 Minimum: 1 Tray
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Active CMOS 1.9µm x 1.9µm 1296H x 976V 120 1.7V ~ 3.1V 55-WFBGA 55-ODCSP (4.62x3.82) -30°C ~ 70°C
NOIV2SN1300A-QDC Datasheet NOIV2SN1300A-QDC - onsemi NOIV2SN1300A-QDCOS-ND NOIV2SN1300A-QDC onsemi IC IMAGE SENSOR 1.3MP 48LLC 95 - Immediate Available: 95 lei689.25000 1 Minimum: 1 Tray
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Active CMOS 4.8µm x 4.8µm 1280H x 1024V 150 1.8V, 3.3V 168-CPGA 168-PGA -40°C ~ 85°C (TJ)
S204SP Datasheet S204SP - Seek Thermal 2126-S204SP-ND S204SP Seek Thermal THERMAL IMAGE KIT 200X150 35DEG 38 - Immediate Available: 38 lei2,115.76000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 200H x 150V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
S304SP Datasheet S304SP - Seek Thermal 2126-S304SP-ND S304SP Seek Thermal THERMAL CORE STARTER KIT 33 - Immediate Available: 33 lei2,115.76000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 320H x 240V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
S309SP Datasheet S309SP - Seek Thermal 2126-S309SP-ND S309SP Seek Thermal THERMAL CORE STARTER KIT 31 - Immediate Available: 31 lei2,115.76000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 320H x 240V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
AR0521SR2M09SURA0-DP1 Datasheet AR0521SR2M09SURA0-DP1 - onsemi AR0521SR2M09SURA0-DP1-ND AR0521SR2M09SURA0-DP1 onsemi 5MP 1/2 CIS SO 148 - Immediate Available: 148 lei70.77000 1 Minimum: 1 Tray
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Active
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EPC660-CSP68-007 Datasheet EPC660-CSP68-007 - ESPROS Photonics AG 2199-EPC660-CSP68-007-ND EPC660-CSP68-007 ESPROS Photonics AG IC TOF IMAGER 320X240 108 - Immediate Available: 108 lei283.57111 9 Minimum: 9 Tray
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Active CCD 20µm x 20µm 320H x 240V 158 2.25V ~ 3.63V 68-XFBGA, CSPBGA 68-CSP (9.7x8.66) -40°C ~ 85°C
AR0144CSSM00SUKA0-CPBR2 Datasheet AR0144CSSM00SUKA0-CPBR2 - onsemi AR0144CSSM00SUKA0-CPBR2OS-ND AR0144CSSM00SUKA0-CPBR2 onsemi 1MP 1/4 CIS SO 1.575 - Immediate Available: 1.575 lei115.75200 5 Minimum: 5 Tray
Alternate Packaging
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Active CMOS 3µm x 3µm 1280H x 800V 60
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69-WFBGA, CSPBGA 69-ODCSP (5.55x5.57)
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OPT8320NBP Datasheet OPT8320NBP - Texas Instruments 296-43355-ND OPT8320NBP Texas Instruments IC IMAGE SENSOR TOF 3D 56COG 391 - Immediate
1.500 - Factory Stock
Available: 391
lei236.80000 1 Minimum: 1 Tray
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Active 3D Time of Flight 30µm x 30µm 80H x 60V 1000 1.7V ~ 3.6V 56-VFBGA 56-COG (8.07x5.36) 0°C ~ 70°C (TA)
MLX90640ESF-BAA-000-TU Datasheet MLX90640ESF-BAA-000-TU - Melexis Technologies NV MLX90640ESF-BAA-000-TU-ND
MLX90640ESF-BAA-000-TU Melexis Technologies NV SENSOR DGTL -40C-85C TO39 746 - Immediate Available: 746 lei261.48000 1 Minimum: 1 Bulk
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Active Thermal
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32H x 24V
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2.9V ~ 3.6V TO-205AD, TO-39-3 Metal Can TO-39 -40°C ~ 85°C
82635DSF450 Datasheet 82635DSF450 - Intel RealSense 2311-82635DSF450-ND
82635DSF450 Intel RealSense CAMERA DEPTH MODULE ID F450 267 - Immediate Available: 267 lei503.50000 1 Minimum: 1 Box Intel® RealSense™ ID Solution F450 Active Human Detection, Facial Recognition
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-
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3.15V ~ 5V
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0°C ~ 60°C
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82635DSF455 - Intel RealSense 2311-82635DSF455-ND
82635DSF455 Intel RealSense CAMERA DEPTH PERIPH ID F455 523 - Immediate Available: 523 lei715.50000 1 Minimum: 1 Box Intel® RealSense™ ID Solution F455 Active Human Detection, Facial Recognition
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-
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3.15V ~ 5V
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0°C ~ 60°C
AR0330CS1C12SPKA0-CR Datasheet AR0330CS1C12SPKA0-CR - onsemi AR0330CS1C12SPKA0-CROS-ND AR0330CS1C12SPKA0-CR onsemi IMAGE SENSOR 3.926 - Immediate Available: 3.926 lei81.49000 1 Minimum: 1 Tray
Alternate Packaging
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Active CMOS 2.2µm x 2.2µm 2304H x 1536V 30 1.7V ~ 1.9V, 2.4V ~ 3.1V 61-WFBGA, CSPBGA 61-ODCSP (6.28x6.65) -30°C ~ 70°C (TJ)
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108011 - Basler Inc. 2938-108011-ND 108011 Basler Inc. 4208 X 3120, 30 FPS, COLOR 27 - Immediate Available: 27 lei477.00000 1 Minimum: 1 Box
Alternate Packaging
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Active CMOS 1.1µm x 1.1µm 4208H x 3120V 30 4.5V ~ 5.5V Module
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0°C ~ 50°C
S209SP Datasheet S209SP - Seek Thermal 2126-S209SP-ND
S209SP Seek Thermal S209SP, STARTER KIT, 200X150, 16 30 - Immediate Available: 30 lei2,096.47000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 200H x 150V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
S202SP Datasheet S202SP - Seek Thermal 2126-S202SP-ND
S202SP Seek Thermal S202SP, STARTER KIT, 200X150, 61 49 - Immediate Available: 49 lei2,115.76000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 200H x 150V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
MS202SP Datasheet MS202SP - Seek Thermal 2126-MS202SP-ND
MS202SP Seek Thermal THERMAL IMAGING KIT 200X150, 61D 29 - Immediate Available: 29 lei2,698.34000 1 Minimum: 1 Box Micro Core Active Thermal 12µm x 12µm 200H x 150V 9 3.3V ~ 5V Module Module 0°C ~ 65°C
MS201SP Datasheet MS201SP - Seek Thermal 2126-MS201SP-ND
New Product
MS201SP Seek Thermal THERMAL IMAGING KIT 200X150, 90D 28 - Immediate Available: 28 lei2,698.34000 1 Minimum: 1 Box Micro Core Active Thermal 12µm x 12µm 200H x 150V 9 3.3V ~ 5V Module Module 0°C ~ 65°C
S206SP Datasheet S206SP - Seek Thermal 2126-S206SP-ND
New Product
S206SP Seek Thermal THERMAL IMAGING KIT 200X150, 21D 28 - Immediate Available: 28 lei2,698.34000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 200H x 150V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
S306SP Datasheet S306SP - Seek Thermal 2126-S306SP-ND
S306SP Seek Thermal THERMAL IMAGING KIT 320X240, 35D 27 - Immediate Available: 27 lei2,698.34000 1 Minimum: 1 Box Mosaic Core Active Thermal 12µm x 12µm 320H x 240V 9 3.3V ~ 5V Module Module -10°C ~ 60°C
EPC611-CSP24-001 Datasheet EPC611-CSP24-001 - ESPROS Photonics AG 2199-EPC611-CSP24-001TR-ND EPC611-CSP24-001 ESPROS Photonics AG IC TIME-OF-FLIGHT 0 Available: 0
Standard Lead Time 2 Weeks
lei23.74400 1.000 Minimum: 1.000 Tape & Reel (TR)
Alternate Packaging
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Active 3D Time of Flight 8µm x 8µm 8H X 8V 8000 8V ~ 9V
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-40°C ~ 85°C
EPC611-CSP24-001 Datasheet EPC611-CSP24-001 - ESPROS Photonics AG 2199-EPC611-CSP24-001CT-ND EPC611-CSP24-001 ESPROS Photonics AG IC TIME-OF-FLIGHT 405 - Immediate Available: 405 lei65.30000 1 Minimum: 1 Cut Tape (CT)
Alternate Packaging
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Active 3D Time of Flight 8µm x 8µm 8H X 8V 8000 8V ~ 9V
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-40°C ~ 85°C
EPC611-CSP24-001 Datasheet EPC611-CSP24-001 - ESPROS Photonics AG 2199-EPC611-CSP24-001DKR-ND EPC611-CSP24-001 ESPROS Photonics AG IC TIME-OF-FLIGHT 405 - Immediate Available: 405 Digi-Reel® 1 Minimum: 1 Digi-Reel®
Alternate Packaging
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Active 3D Time of Flight 8µm x 8µm 8H X 8V 8000 8V ~ 9V
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-40°C ~ 85°C
AR0130CSSC00SPBA0-DR Datasheet AR0130CSSC00SPBA0-DR - onsemi AR0130CSSC00SPBA0-DROS-ND AR0130CSSC00SPBA0-DR onsemi IMAGE SENSOR MONO CMOS 1.356 - Immediate
687.040 - Factory Stock
Available: 1.356
lei70.51000
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Tray
Alternate Packaging
Automotive, AEC-Q100 Last Time Buy CMOS 3.75µm x 3.75µm 1280H x 960V 45 1.8V ~ 2.8V 48-LCC 48-PLCC (11.43x11.43) -30°C ~ 70°C (TA)
EPC901-CSP32-033 Datasheet EPC901-CSP32-033 - ESPROS Photonics AG 2199-EPC901-CSP32-033TR-ND EPC901-CSP32-033 ESPROS Photonics AG IC CCD LINE SENSOR 1024X1 0 Available: 0
Standard Lead Time 2 Weeks
lei72.05880 1.000 Minimum: 1.000 Tape & Reel (TR)
Alternate Packaging
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Active CCD 7.5µm x 120µm 1024H x 1V 50000 2.7V ~ 3.45V 32-XFBGA, CSPBGA 32-CSP (8.08x1.32) -40°C ~ 85°C
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22:14:07 10.15.2021